Comparison of temperature distribution in nanosized transistors using modern heat transfer thermal model
Keywords:
Dual-Phase-Lag model, nanosized structures, FinFETs, temperaturę distribution, Fourier-Kirchhoff modelAbstract
In this paper two modern electronic structures have been presented. The structures are prototypical Fin Field Effect Transistors. One of them is design in 5 nm technology node while the second one is manufactured by the 12 nm technology node. The temperaturę distribution in these nanosized structures has been determined and compared between each other. Furthermore, to obtain the temperature distribution in considered electronic structures, the Dual-Phase-Lag model has been applied. This methodology is appropriate for electronic structures produced in nanometric. Apart from that, the comparison to the Fourier-Kirchhoff model has also been prepared. All results have been described and final conclusions have also been presented
References
N. Jain, B. Raj Capacitance/Resistance Modeling and Analog Performance Evaluation of 3-D SOI FinFET Structure for Circuit Perspective Applications, Word Sientific News, An International Scientific Journal, 2018.
J. P. Colinge Multiple-gate SOI MOSFETs, Solid State Electron, 2004.
J. P. Colinge, A. Chandraksan FinFETs and other multi-gate transistors, Springer, 2008.
D. Y. Tzou, A Unified Field Approach for Heat Conduction From Macro- to Micro-Scales, Transactions of ASME J. Heat Transfer, 8–16, 1995.
M. Zubert, M. Janicki, T. Raszkowski, A.Samson, The Thermal Model of Fin-FET Transistor, Proc. of 21st International Workshop on Thermal Investigations of ICs and Systems, Paris, 2015.
M. Zubert, T. Raszkowski, A.Samson, M. Janicki, A. Napieralski The distributed thermal model of fin field effect transistor, Microelectronics Reliability, 2016.
T. Raszkowski, A. Samson, M. zubert, M. Janicki Comparison of temperature distribution in FinFETs and GAAFETs based on Dual-Phase-Lag heat transfer model, Proc. of 19th Electronics Packaging Technology Conference, Singapore, 2017.
